Position Summary: The Imaging Operator’s responsibility is to operate the Chemical Clean Line and Photo resist Coat Cut Sheet Laminator by work instructions and company procedures. To understand and check travelers to verify part counts and/or any special instructions concerning tool numbers and work order numbers. This includes checking the correct core and quantity, resist thickness, and artwork. Panel size determines what printer to be used. Panel or Pattern plating and Mil thickness of coated resist on panels. Use of Diazo and Silver films on panels. Registration of each shot. Also, responsible for changing filters and chemistries, maintaining equipment according to maintenance schedules and company procedures, and keeping a clean and safe area. May assist in the training of new employees in the area.
Qualifications: To perform this job successfully, an individual must have one (1) year of printed circuit board experience. The individual must also be able to perform each essential duty satisfactorily. The requirements listed below are representative of the knowledge, skill, and/or ability required.
Responsibilities:
Physical Requirements:
Education / Experience:
ITAR Compliance Notice
This position requires compliance with the International Traffic in Arms Regulations (ITAR). Under ITAR, candidates must be a U.S. citizen, U.S. lawful permanent resident (e.g., "Green Card" holder), asylee, or refugee as defined by 8 U.S.C. 1324b(a)(3). Applicants who do not meet this requirement may not be eligible for employment in this position.
Summit Interconnect is an Equal Opportunity Employer
We are committed to fostering an inclusive and diverse workplace where everyone is valued and respected. We provide equal employment opportunities to all employees and applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, genetic information, veteran status, or any other legally protected characteristic
Chuck Callahan
Our innovative software-backed facilities feature advanced technologies and extensive capabilities designed to fabricate all of your designs, from quick-turn boards to complex, high-layer count boards with blind and buried vias.
If you want to use emerging technologies or don’t see the capability you need listed below, please contact Summit for engineer support.